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BOWA Automotive focuses on high-performance components for high-temperature applications in brake pad wear sensors and chassis wiring in the axle area!
The sensors and wiring in the axle and brake area are a critical aspect of modern vehicles. It is a complex system that significantly influences the safety and functionality of the vehicle.
The requirements of high temperature and media resistance, vibration resistance and resistance to all environmental influences play a decisive role in the implementation.
The components in the brake area and the chassis cabling in the axle area must meet the highest automotive standards. They are specially developed for this purpose and are subject to strict tests before the component is released.
Brake pad wear indicator
A brake pad wear indicator is a sensor connected to a control device that informs the driver that the brake pad has reached its defined residual pad thickness.
When the wear limit on the brake pad is reached, the warning contact embedded in the brake pad is ground through. This interrupts the circuit and the driver is notified that the vehicle’s brake pads need to be replaced.
The product places high demands on accuracy, temperature resistance and mechanical resilience and is an important component for road safety.
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Wiring harnesses
Wiring harnesses designed as axle wiring for brake pad wear indicators are an important part of the vehicle, responsible for the electrical connection between the various components in the wheel suspension and wheel housing area.
The axle cabling in the wheel arch must be able to withstand mechanical stress caused by vibrations and steering movements as well as extreme environmental influences such as cold, heat, moisture, dirt and stone chipping. Coordination with the specified interfaces and precise routing are crucial to ensure functionality and safety.
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Customized solutions
Electrical components or circuits are accommodated in a housing or capsule by insert molding.
This encapsulation serves to protect the electronics from external influences such as moisture, dust, vibrations and mechanical stress. The encapsulation ensures the necessary reliability and durability of the electronic components.
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